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The pin grid array at the bottom of a XC68020, a prototype of the Motorola 68020 microprocessor
The pin grid array at the bottom of a XC68020, a prototype of the Motorola 68020 microprocessor

The pin grid array or PGA is a type of packaging used for integrated circuits, particularly microprocessors. The Motorola 68020 is a 32-bit Microprocessor from Motorola, released in 1984. Microchipsjpg|right|thumb|200px|Microchips ( EPROM memory with a transparent window showing the integrated circuit inside A microprocessor incorporates most or all of the functions of a Central processing unit (CPU on a single Integrated

PGA

On a PGA, the integrated circuit (IC) is mounted in a ceramic slab of which one face is covered, or partially covered, in a square array of metal pins. The word ceramic is derived from the Greek word κεραμικός ( keramikos) The pins can then be inserted into the holes rapidly in a printed circuit board and soldered in place. A printed circuit board, or PCB, is used to mechanically support and electrically connect Electronic components using conductive pathways or traces A solder is a fusible metal Alloy with a melting point or melting range of 90 to 450 ° C (200 to 840 ° F) used in a process called They are almost always spaced 2. 54 mm (a tenth of an inch) apart. The Millimetre ( American spelling: millimeter, symbol mm) is a unit of Length in the Metric system, equal to Inches redirects here To see the Les Savy Fav album see Inches. For a given number of pins, this type of package occupies less space than older types such as the dual in-line package (DIP). In Microelectronics, a dual in-line package (DIP, sometimes called a DIL package is an electronic device package with a rectangular housing and two parallel rows

PGA Variants

The plastic pin grid array (PPGA) and later flip-chip pin grid array (FCPGA) versions were both created by Intel Corporation for their Pentium processors, and are often used on motherboards with ZIF (Zero Insertion Force) sockets to protect the delicate pins. Flip-chip pin grid array ( FC-PGA or FCPGA) is a form of Pin grid array processor architecture package in which the die The Pentium brand refers to Intel 's single-core x86 Microprocessor based on the P5 fifth-generation Microarchitecture. A motherboard is the central or primary Printed circuit board (PCB making up a complex electronic system such as a modern Computer or Laptop ZIF is an acronym for zero insertion force, a concept used in the design of IC sockets invented to avoid problems caused by applying force upon insertion and A CPU socket or CPU slot is a connector on a computer's Motherboard that accepts a CPU and forms an electrical interface with it

See also

Flip-chip pin grid array ( FC-PGA or FCPGA) is a form of Pin grid array processor architecture package in which the die You may be looking for Cornish Pilot Gig Association. CPGA stands for Ceramic Pin Grid Array, a type of packaging used by Integrated The Organic Pin Grid Array ( OPGA) is a type of connection for Integrated circuits and especially CPUs, where the Silicon In Microelectronics, a dual in-line package (DIP, sometimes called a DIL package is an electronic device package with a rectangular housing and two parallel rows A single in-line package (or SIP is an electronic device package which has one row of connecting pins The zig-zag in-line package or ZIP was a short-lived packaging technology for Integrated circuits particularly dynamic RAM chips A ball grid array ( BGA) is a type of Surface-mount packaging used for Integrated circuits BGA The BGA is descended from the The land grid array ( LGA) is a type of Surface-mount packaging used for Integrated circuits It can be electrically connected In Elementary number theory, a centered square number is a centered Figurate number that gives the number of dots in a square with a dot in the
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