The land grid array (LGA) is a type of surface-mount packaging used for integrated circuits. Surface-mount technology ( SMT) is a method for constructing electronic circuits in which the components (SMC or Surface Mounted Components are mounted directly onto Microchipsjpg|right|thumb|200px|Microchips ( EPROM memory with a transparent window showing the integrated circuit inside It can be electrically connected to a PCB either by the use of a socket or by soldering directly to the PCB. A printed circuit board, or PCB, is used to mechanically support and electrically connect Electronic components using conductive pathways or traces A CPU socket or CPU slot is a connector on a computer's Motherboard that accepts a CPU and forms an electrical interface with it Soldering is a process in which two or more Metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low

Contents 1 Use in microprocessors 2 External links 3 List of microprocessor LGA sockets 3.1 AMD 3.2 Intel 4 References 5 See also

Use in microprocessors

The LGA is used as a physical interface for microprocessors of the Intel Pentium 4, Intel Xeon, Intel Core 2 and AMD Opteron families. The Pentium 4 brand refers to Intel 's line of single- core mainstream desktop and Laptop Central processing units (CPUs introduced The Xeon brand refers to many families of Intel 's x86 Multiprocessing CPUs – for dual-processor (DP and multi-processor (MP configuration The Core 2 brand refers to a range of Intel 's consumer 64-bit dual-core and 2x2 MCM quad-core CPUs with the X86-64 instruction set The Opteron is AMD 's X86 server processor line and was the first processor to implement the AMD64 Instruction set architecture (known Unlike the pin grid array (PGA) interface found on most AMD and older Intel processors, there are no pins on the chip; in place of the pins are pads of bare gold-plated copper that touch pins on the motherboard. A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging A motherboard is the central or primary Printed circuit board (PCB making up a complex electronic system such as a modern Computer or Laptop

While LGA sockets have been in use as early as 1996 by the MIPS R10000 and HP PA-8000 processors, the interface did not gain widespread use until Intel introduced their LGA platform starting with the 5x0 and 6x0 sequence Prescott core Pentium 4 in 2004. MIPS (originally an acronym for Microprocessor without Interlocked Pipeline Stages) is a RISC microprocessor architecture developed by MIPS Technologies PA-RISC is a Microprocessor architecture developed by Hewlett-Packard 's Systems & VLSI Technology Operation. The Pentium 4 brand refers to Intel 's line of single- core mainstream desktop and Laptop Central processing units (CPUs introduced All Pentium D and Core 2 desktop processors currently use an LGA socket. The Pentium D brand refers to two series of Dual-core 64-bit X86 processors with the NetBurst Microarchitecture manufactured The Core 2 brand refers to a range of Intel 's consumer 64-bit dual-core and 2x2 MCM quad-core CPUs with the X86-64 instruction set As of Q1 2006 Intel switched the Xeon server platform to LGA starting with the 5000-series models. AMD introduced their server LGA platform starting with the 2000-series Opteron in Q2 2006. The Opteron is AMD 's X86 server processor line and was the first processor to implement the AMD64 Instruction set architecture (known AMD offers the Athlon 64 FX-74 on socket 1207FX through ASUS's L1N64-SLI WS motherboard as the only desktop LGA solution in the desktop market from AMD currently.

The Intel desktop LGA socket is dubbed Socket 775 or Socket T while the server variant is dubbed Socket J or Socket 771. Intel supposedly decided to switch to an LGA socket because it provides a larger contact point, allowing, for example, higher clock frequencies. The LGA setup provides higher pin densities, allowing more power contacts and thus a more stable power supply to the chip. Motherboard vendors have complained that LGA packaging was introduced solely to move the burden of bent pin problems from Intel to the electronics vendors.

The AMD server LGA socket is designated Socket 1207 (sometimes referred to as Socket-F) Similar to Intel, AMD decided to use an LGA socket because it allows higher pin densities. Socket F is a CPU socket designed by AMD for its Opteron line of CPUs, and released on August 15 2006. The required size of a 1207-pin PGA would simply be too large and would consume too much space on motherboards.

External links

• Socket F to debut in July
• Two more pictures of Socket F
• LGA interface

List of microprocessor LGA sockets

AMD

• Socket F

Intel

• Socket T
• Socket J
• Socket B
• Socket R

References

See also

• Dual in-line package (DIP)
• Pin grid array (PGA)
• Ball grid array (BGA)

Socket F is a CPU socket designed by AMD for its Opteron line of CPUs, and released on August 15 2006. Socket J, also known as LGA 771, is a CPU interface introduced by Intel in 2006 In Microelectronics, a dual in-line package (DIP, sometimes called a DIL package is an electronic device package with a rectangular housing and two parallel rows A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging A ball grid array ( BGA) is a type of Surface-mount packaging used for Integrated circuits BGA The BGA is descended from the

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