A Low-profile Quad Flat Package (LQFP) is a surface mount integrated circuit package format with component leads extending from each of the four sides. Surface-mount technology ( SMT) is a method for constructing electronic circuits in which the components (SMC or Surface Mounted Components are mounted directly onto Microchipsjpg|right|thumb|200px|Microchips ( EPROM memory with a transparent window showing the integrated circuit inside Pins are numbered counter-clockwise from the index dot. Spacing between pins can vary; common spacings are 0. 4, 0. 5, 0. 65 and 0. 80 mm intervals.

See also

QFP

External links

• Image of an LQFP IC

A QFP or Quad Flat Package is an Integrated circuit package with leads extending from each of the four sides

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