Pentium II: example of an interposer, integrated circuit die to ball grid array chip carrier

An interposer is an electrical interface routing between one socket or connection to another. A die in the context of Integrated circuits is a small block of semiconducting material on which a given functional circuit is fabricated A ball grid array ( BGA) is a type of Surface-mount packaging used for Integrated circuits BGA The BGA is descended from the A chip carrier, also known as a chip container or chip package, is a container for an Integrated circuit. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection. ^[1]

Interposer comes from the Latin, interpōnere, meaning 'to put between. ' ^[2]

A common example of an interposer is an integrated circuit die to BGA, such as in the Pentium II. A die in the context of Integrated circuits is a small block of semiconducting material on which a given functional circuit is fabricated BGA can refer to Ball Grid Array, a type of surface-mount packaging used for integrated circuits Battle Ground Academy, a private school The Pentium II brand refers to Intel 's sixth-generation Microarchitecture (" Intel P6 " and x86 -compatible Microprocessors This is done through various substrates, both rigid and flexible, most commonly FR4 for rigid, and polyimide for flexible. FR-4, an abbreviation for Flame Retardant 4 is a type of material used for making a Printed circuit board (PCB Properties Thermosetting polyimides are known for thermal stability good chemical resistance excellent mechanical properties and characteristic orange/yellow color ^[1]

See also

• Integrated circuit
• Semiconductor fabrication
• Die preparation

References

1. ^ ^{a b} Package Substrates/Interposers
2. ^ interposes - definition of interposes by the Free Online Dictionary, Thesaurus and Encyclopedia