Flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array processor architecture package in which the die faces downwards on the top of the CPU with the back of the die exposed. Flip chip, also known as Controlled Collapse Chip Connection or its acronym C4, is a method for interconnecting Semiconductor devices such as A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging A die in the context of Integrated circuits is a small block of semiconducting material on which a given functional circuit is fabricated This allows the die to have a more direct contact with the heatsink or other cooling mechanism. A heat sink (or heatsink) is an environment or object that absorbs and dissipates heat from another object using Thermal contact (either direct or radiant
The FC-PGA package is used on certain Intel Celeron, Pentium III, and Pentium 4 family microprocessors. The Celeron brand is a range of X86 CPUs from Intel targeted at budget/value Personal computers €”with the motto "delivering great quality Pentium III variants Katmai The first Pentium III variant was the Katmai (Intel product code 80525 The Pentium 4 brand refers to Intel 's line of single- core mainstream desktop and Laptop Central processing units (CPUs introduced A microprocessor incorporates most or all of the functions of a Central processing unit (CPU on a single Integrated FC-PGA processors fit into zero insertion force (ZIF) Socket 370 and Socket 478 motherboard sockets; similar packages have also been used by AMD. ZIF is an acronym for zero insertion force, a concept used in the design of IC sockets invented to avoid problems caused by applying force upon insertion and Socket 370 (also known as the PGA370 socket) is a common format of CPU socket first used by Intel for Pentium III and Celeron In Computing, Socket 478 is a type of CPU socket used for Intel 's Pentium 4 and Celeron series CPUs. A CPU socket or CPU slot is a connector on a computer's Motherboard that accepts a CPU and forms an electrical interface with it
FC-PGA packaging is used by Pentium III processors, and Celeron 533, unofficially called 533A, processors onward. Earlier Celeron processors used PPGA packaging, the fastest was at 533 MHz. A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging
FC-PGA2, adds a heat spreader over the silicon core and is used on late Pentium III processors and most Pentium 4 and Celeron processors using Socket 478 (180nm Willamette and 130nm Northwood). A heat spreader is most often simply a copper plate having high Thermal conductivity. FC-PGA4 is used by Intel Pentium 4 and Celeron D processors using 90 nm process (Prescott based) also with integrated heat spreader. Intel Mobile Pentium 4-M processors did not have the integrated heat spreader and so use FC-PGA packaging.
Intel replaced FC-PGA style packaging with the land grid array (LGA775) or FC-LGA4 packaging on Prescott-based Pentium 4 and Celeron D processors which no longer have pins. The land grid array ( LGA) is a type of Surface-mount packaging used for Integrated circuits It can be electrically connected The Celeron brand is a range of X86 CPUs from Intel targeted at budget/value Personal computers €”with the motto "delivering great quality
The micro-FCPGA (flip-chip plastic grid array) package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. In Chemistry, epoxy or polyepoxide is a Thermosetting Epoxide Polymer that cures (polymerizes and crosslinks when mixed with a The package uses 478 pins, which are 2. 03 mm long and . 32 mm in diameter. While there are several micro-FCPGA socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the processor. Different from micro-PGA, the micro-FCPGA does not have an interposer and it includes capacitors on the bottom side. An interposer is an electrical interface routing between one socket or connection to another