In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, usually protruding from the larger sides of the package and bent downward. A memory management unit ( MMU) sometimes called paged memory management unit ( PMMU) is a Computer hardware component responsible for handling Microelectronics is a subfield of Electronics. Microelectronics as the name suggestsis related to the study and manufacture or Microfabrication, of electronic A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.
DIPs may be used for integrated circuits (ICs, "chips"), like microprocessors, or for arrays of discrete components such as resistors or toggle switches. Microchipsjpg|right|thumb|200px|Microchips ( EPROM memory with a transparent window showing the integrated circuit inside A microprocessor incorporates most or all of the functions of a Central processing unit (CPU on a single Integrated A toggle switch is a class of Electrical switches that are actuated by a mechanical Lever, handle or rocking mechanism They can be mounted on a printed circuit board (PCB) either directly using through-hole technology, or using inexpensive sockets to allow for easy replacement of the device and to reduce the risk of overheat damage during soldering. A printed circuit board, or PCB, is used to mechanically support and electrically connect Electronic components using conductive pathways or traces Through-hole technology, also spelled "thru-hole" refers to the mounting scheme used for Pin-through-hole ( PTH) Electronic components that
Dual in-line packages were invented at Fairchild in 1965 and, by allowing integrated circuits to be packaged more densely than previous round packages, made it possible to build complex systems such as computers. Present day Fairchild Semiconductor International Inc is a spin-off company resulting from reconstitution of assets in National Semiconductor [1] The package was well-suited to automated assembly equipment; a printed circuit board could be populated with scores or hundreds of ICs, then have all devices soldered at once and passed on to automated testing machine, with very little human labor required. Printed Circuit is the pseudonym for Claire Broadley an artist from Leeds Yorkshire who makes electronic pop music However, the packages were still large with respect to the integrated circuits within them. By the end of the 20th century, most ICs were packaged in surface-mount packages, which allowed further reduction in the size of systems.
DIPs were the mainstream of the microelectronics industry in the 1970s and 80s. Their use has subsided in recent years due to the emerging new surface-mount technology (SMT) packages such as PLCC and SOIC.
For programmable devices like EPROMs and GALs, DIPs remained popular for many years due to their easy handling with external programming circuitry. However, with In-System Programming (ISP) technology now state of the art, this advantage of DIPs is rapidly losing importance as well. Through the 1990s, devices with pin counts below 20 were manufactured in a DIP format in addition to the newer formats. Since about 2000, newer devices are often unavailable in the DIP format.
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Pin spacing
The most common DIPs have an inter-lead spacing (lead pitch) of 0. 1" (2. Inches redirects here To see the Les Savy Fav album see Inches. 54 mm) and a row spacing of either 0. The metre or meter is a unit of Length. It is the basic unit of Length in the Metric system and in the International 3 in (7. 62 mm) or 0. 6 in (15. 24 mm). Typical pin counts are 8 or any even number from 14 to 24 (less common 28) for 0. 3 in packages, and 24, 28, 32 or 40 (less common 36, 48 or 52) for 0. 6 in packages. Where there is a need to differentiate between the two widths for the same pin count the term "Skinny DIP" is used to refer to the 0. 3 in version. JEDEC-standards also specify less common packages with a row spacing of 0. JEDEC Solid State Technology Association, formerly known as J oint E lectron D evice E ngineering C ouncil ( JEDEC) or Joint 4 in (10. 16 mm), or 0. 9 in (22. 86 mm) with a pin-count of up to 64. Other standardized variants include a lead pitch of 0. 07 in (1. 778 mm) at a row spacing of 0. 3 in, 0. 6 in or 0. 75 in. The former Soviet Union and Eastern bloc countries used similar packages, but with a metric inter-lead spacing of 2. 5 mm, rather than 2. 54 mm (or 0. 1 in).
Several DIP variants exist, mostly distinguished by packaging material:
- Ceramic Dual In-line Package (CERDIP)
- Plastic Dual In-line Package (PDIP)
- Shrink Plastic Dual In-line Package (SPDIP) – A shrink version of the PDIP with a 0. 07 in (1. 778 mm) lead pitch
Orientation and pin numbering
DIPs have an orientation notch or dot on one end. If the chip is held so that the long axis is vertical and the notch is at the top end, pin #1 is the topmost pin in the left column. Pins are numbered counter-clockwise from there, i. e. top to bottom along the left column, then bottom to top along the right column. This allows automated chip-insertion machinery to ensure correct orientation of the chip by mechanical sensing.
See also
- Single in-line package (SIP)
- Zig-zag in-line package (ZIP)
- Pin grid array (PGA)
- DIP switch
- QFP (Quad Flat Package)
References
- Intel (1996). A single in-line package (or SIP is an electronic device package which has one row of connecting pins The zig-zag in-line package or ZIP was a short-lived packaging technology for Integrated circuits particularly dynamic RAM chips A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging A DIP switch is a set of manual electric switches that are packaged in a group in a standard Dual in-line package (DIP (the whole package unit may also be referred A QFP or Quad Flat Package is an Integrated circuit package with leads extending from each of the four sides Packaging (databook). ISBN 1-55512-254-X.
This article contains material from the Federal Standard 1037C, which, as a work of the United States Government, is in the public domain. Federal Standard 1037C, entitled Telecommunications Glossary of Telecommunication Terms is a United States Federal Standard issued by the General Services Administration A work of the United States government, as defined by United States copyright law, is "a work prepared by an officer or employee of the U The public domain is a range of abstract materials &ndash commonly referred to as Intellectual property &ndash which are not owned or controlled by anyone
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